A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a coloring agent (E). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1), An amount of the epoxy compound (B11) with respect to a total amount of the carboxyl group-containing resin (A), the thermosetting component (B), and the photopolymerizable component (C) is within a range of 15 to 40 weight %.