Invention Grant
- Patent Title: Touch sensitive processing apparatus, electronic system and method thereof for configuring interconnection parameters with touch panel
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Application No.: US15723289Application Date: 2017-10-03
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Publication No.: US10261633B2Publication Date: 2019-04-16
- Inventor: Chin-Fu Chang , Shang-Tai Yeh
- Applicant: EGALAX_EMPIA TECHNOLOGY INC.
- Applicant Address: TW Taipei
- Assignee: EGALAX_EMPIA TECHNOLOGY INC.
- Current Assignee: EGALAX_EMPIA TECHNOLOGY INC.
- Current Assignee Address: TW Taipei
- Agency: Wpat, PC
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/14 ; G06F3/041 ; G09G5/14 ; G06F3/0354

Abstract:
The present application provides a touch sensitive processing method for configuring interconnection parameters between a touch panel and a touch sensitive processing apparatus in an electronic system. The method comprises: connecting, by an interconnection network of the apparatus, P first circuits of a first apparatus connector with a detecting circuit of the touch sensitive processing apparatus, respectively; detecting, by the detecting circuit, an impedance value of each of the first circuits sequentially via the interconnection network; and determining that there are M consecutive first touch sensitive electrodes connected to the M consecutive first circuits based on the impedance values.
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