Invention Grant
- Patent Title: Modular backplane
-
Application No.: US15761644Application Date: 2015-09-22
-
Publication No.: US10261931B2Publication Date: 2019-04-16
- Inventor: Miroslaw Pierre Klaba
- Applicant: OVH
- Applicant Address: FR Roubaix
- Assignee: OVH
- Current Assignee: OVH
- Current Assignee Address: FR Roubaix
- Agency: BCF LLP
- International Application: PCT/EP2015/071801 WO 20150922
- International Announcement: WO2017/050359 WO 20170330
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42

Abstract:
A backplane (1) comprising —a first module connector (2d) configured to receive a first printed circuit board module (5d) and including a first connector portion (23d-26d); —a second module connector (2e) configured to receive a second printed circuit board module (5e) and including a second connector portion (23e-26e), the first connector portion (23d-26d) being connected to the second connector portion (23e-26e) through a backplane bus.
Public/Granted literature
- US20180349309A1 MODULAR BACKPLANE Public/Granted day:2018-12-06
Information query