Invention Grant

  • Patent Title: Modular backplane
  • Application No.: US15761644
    Application Date: 2015-09-22
  • Publication No.: US10261931B2
    Publication Date: 2019-04-16
  • Inventor: Miroslaw Pierre Klaba
  • Applicant: OVH
  • Applicant Address: FR Roubaix
  • Assignee: OVH
  • Current Assignee: OVH
  • Current Assignee Address: FR Roubaix
  • Agency: BCF LLP
  • International Application: PCT/EP2015/071801 WO 20150922
  • International Announcement: WO2017/050359 WO 20170330
  • Main IPC: G06F13/40
  • IPC: G06F13/40 G06F13/42
Modular backplane
Abstract:
A backplane (1) comprising —a first module connector (2d) configured to receive a first printed circuit board module (5d) and including a first connector portion (23d-26d); —a second module connector (2e) configured to receive a second printed circuit board module (5e) and including a second connector portion (23e-26e), the first connector portion (23d-26d) being connected to the second connector portion (23e-26e) through a backplane bus.
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