Invention Grant
- Patent Title: Compact ejectable component assemblies in electronic devices
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Application No.: US14967422Application Date: 2015-12-14
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Publication No.: US10262245B2Publication Date: 2019-04-16
- Inventor: Jason Sloey , Michelle Yu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H04B1/3816 ; G06K13/08 ; G06K13/06 ; G06K7/00 ; H05K5/00

Abstract:
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.
Public/Granted literature
- US20160100496A1 COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES Public/Granted day:2016-04-07
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