- Patent Title: Method of fabricating electrodes, method of fabricating thin film transistor, method of fabricating array substrate, thin film transistor, array substrate, and display apparatus
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Application No.: US15741737Application Date: 2017-06-30
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Publication No.: US10262860B2Publication Date: 2019-04-16
- Inventor: Liangchen Yan , Xiaoguang Xu , Linfeng Lan , Lei Wang , Junbiao Peng
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , South China University of Technology
- Applicant Address: CN Beijing CN Guangzhou, Guangdong
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,South China University of TechnoIogy
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,South China University of TechnoIogy
- Current Assignee Address: CN Beijing CN Guangzhou, Guangdong
- Agency: Intellectual Valley Law, P.C.
- Priority: CN201610936120 20161101
- International Application: PCT/CN2017/091131 WO 20170630
- International Announcement: WO2018/082327 WO 20180511
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/02 ; H01L29/417 ; H01L27/12 ; H01L21/28 ; H01L29/423 ; H01L29/66 ; H01L29/786
Abstract:
The present application discloses a method of fabricating a plurality of electrodes. The method includes forming a hydrophobic pattern containing a hydrophobic material on a base substrate, the hydrophobic pattern has a first ridge on a first edge of the hydrophobic pattern, the hydrophobic pattern has a thickness at the first ridge greater than that in a region outside a region corresponding to the first ridge; removing a portion of the hydrophobic pattern outside the region corresponding to the first ridge; and forming a first electrode on a first side of the first ridge and a second electrode on a second side of the first ridge.
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