Invention Grant
- Patent Title: Electrostatic chuck device
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Application No.: US15510224Application Date: 2015-09-24
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Publication No.: US10262886B2Publication Date: 2019-04-16
- Inventor: Hitoshi Kouno , Kentaro Takahashi , Fumihiro Gobou
- Applicant: SUMITOMO OSAKA CEMENT CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
- Current Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Merchant & Gould P.C.
- Priority: JP2014-201302 20140930; JP2014-201303 20140930
- International Application: PCT/JP2015/076890 WO 20150924
- International Announcement: WO2016/052291 WO 20160407
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687 ; H01L21/67 ; H02N13/00 ; H05K7/20 ; H01L21/3065 ; B23Q3/15

Abstract:
Disclosed is an electrostatic chuck device for increasing electrostatic adsorptive force for a focus ring and uniformly cooling the focus ring. In such a device, a mounting table has a holder in the periphery of a placing surface along the circumferential direction of a focus ring, the holder has a pair of banks in the circumferential direction, and an annular groove formed between these banks, and in at least a bank on an outer circumferential position of the focus ring among the pair of the banks, a micro-protruding part including a plurality of micro-protrusions is on a surface facing the focus ring, or convex parts are on a bottom of the groove. The convex parts do not contact the focus ring, and the pair of banks or plurality of micro-protrusions contacts the focus ring and electrostatically adsorbs the focus ring in coordination with the convex parts.
Public/Granted literature
- US20170287764A1 ELECTROSTATIC CHUCK DEVICE Public/Granted day:2017-10-05
Information query
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