Invention Grant
- Patent Title: Circuit for and method of testing bond connections between a first die and a second die
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Application No.: US15379258Application Date: 2016-12-14
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Publication No.: US10262911B1Publication Date: 2019-04-16
- Inventor: Yuqing Gong , Henley Liu , Myongseob Kim , Suresh P. Parameswaran , Cheang-Whang Chang , Boon Y. Ang
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent John J. King
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/00
Abstract:
A circuit for testing bond connections between a first die and a second die is described. The circuit comprises a defect monitoring circuit implemented on the first die, which is configured as a test die; and a plurality of bond connections between the first die and the second die; wherein the defect monitoring circuit is configured to detect a defect in a bond connection of the plurality of bond connections between the first die and the second die. A method of testing bond connections between a first die and a second die is also described.
Information query
IPC分类:
