Invention Grant
- Patent Title: Lateral vias for connections to buried microconductors and methods thereof
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Application No.: US15980546Application Date: 2018-05-15
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Publication No.: US10262931B2Publication Date: 2019-04-16
- Inventor: David P. Adams , Kira L. Fishgrab , Karl Douglas Greth , Michael David Henry , Jeffrey Stevens , V. Carter Hodges , Randy J. Shul , Ronald S. Goeke , Robert K. Grubbs , Scott Silverman
- Applicant: National Technology & Engineering Solutions of Sandia, LLC , Scott Silverman
- Applicant Address: US NM Albuquerque US CA San Marcos
- Assignee: National Technology & Engineering Solutions of Sandia, LLC,Varioscale, Inc.
- Current Assignee: National Technology & Engineering Solutions of Sandia, LLC,Varioscale, Inc.
- Current Assignee Address: US NM Albuquerque US CA San Marcos
- Agent Helen S. Baca
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L23/538 ; H01L23/48 ; H01L25/065 ; H01L23/31 ; H01L23/14
Abstract:
The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
Public/Granted literature
- US20180269143A1 LATERAL VIAS FOR CONNECTIONS TO BURIED MICROCONDUCTORS AND METHODS THEREOF Public/Granted day:2018-09-20
Information query
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