Invention Grant
- Patent Title: Configurable routing for packaging applications
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Application No.: US15378622Application Date: 2016-12-14
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Publication No.: US10262939B2Publication Date: 2019-04-16
- Inventor: Chung-Yu Lu , Hsien-Pin Hu , Shin-Puu Jeng , Shang-Yun Hou , Tzuan-Horng Liu , Shih-Wen Huang , Chun Hua Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/48 ; H01L23/52 ; H01L23/525 ; H01L25/065 ; H01L21/56 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L25/03 ; H01L25/00

Abstract:
Various structures having a fuse and methods for forming those structures are described. An embodiment is a method. The method comprises attaching a first die to a first side of a component using first electrical connectors. After the attaching, at least one of (i) the first die comprises a first fuse, (ii) the first side of the component comprises a second fuse, (iii) a second side of the component comprises a third fuse, the second side being opposite the first side, or (iv) a combination thereof. The method further comprises after the attaching the first die to the first side of the component, blowing the first fuse, the second fuse, the third fuse, or a combination thereof.
Public/Granted literature
- US20170098607A1 Configurable Routing for Packaging Applications Public/Granted day:2017-04-06
Information query
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