Invention Grant
- Patent Title: Bumped resonator structure
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Application No.: US15827729Application Date: 2017-11-30
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Publication No.: US10263170B1Publication Date: 2019-04-16
- Inventor: Markus Brink , Antonio D. Corcoles-Gonzalez , Jay M. Gambetta , Sami Rosenblatt , Firat Solgun
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent David Quinn
- Main IPC: H01L39/02
- IPC: H01L39/02 ; H01L27/18 ; G06N99/00 ; H01L39/24 ; H01L39/22
Abstract:
A technique relates a structure. An inductive element is on a first surface. A capacitive element is on the first surface and a second surface. An interconnect structure is between the first surface and the second surface.
Information query
IPC分类:
