Invention Grant
- Patent Title: System and method for active cooling of on-machine devices
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Application No.: US15009980Application Date: 2016-01-29
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Publication No.: US10263497B2Publication Date: 2019-04-16
- Inventor: Edwin Xikai Sun , Wei Zhu , Shun Feng , Mark R. Cooper , Paul J. Grosskreuz , Robert H. Schmidt
- Applicant: Rockwell Automation Technologies, Inc.
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Boyle Fredrickson, SC
- Main IPC: H02K9/22
- IPC: H02K9/22 ; H02K11/00 ; H02K11/21
Abstract:
A system and method for cooling an enclosed position feedback device mounted to a motor is disclosed. An active cooling device is mounted between the position feedback device and the housing enclosing the position feedback device. A compliant mount is provided to accommodate vibration in the position feedback device. The compliant mount may be a compliant thermal pad positioned between the feedback device and the active cooling device. Optionally, the compliant mount may be provided between the motor and the position feedback device.
Public/Granted literature
- US20170222521A1 System and Method for Active Cooling of On-Machine Devices Public/Granted day:2017-08-03
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