Invention Grant
- Patent Title: Method for assembling a microelectronic chip device in a fabric, chip device, and fabric incorporating a crimped chip device
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Application No.: US14235358Application Date: 2012-04-24
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Publication No.: US10264682B2Publication Date: 2019-04-16
- Inventor: Jean Brun , Delphine Christophe , Lionel Tenchine
- Applicant: Jean Brun , Delphine Christophe , Lionel Tenchine
- Applicant Address: FR Paris FR Bellignat
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES,POLE EUROPEEN DE PLASTURGIE
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES,POLE EUROPEEN DE PLASTURGIE
- Current Assignee Address: FR Paris FR Bellignat
- Agency: Haug Partners LLP
- Priority: FR1102372 20110728; FR1103487 20111116
- International Application: PCT/EP2012/057490 WO 20120424
- International Announcement: WO2013/013843 WO 20130131
- Main IPC: F21V19/00
- IPC: F21V19/00 ; H05K1/02 ; H05K3/00 ; H01L23/498 ; H05K1/03 ; H05K1/18 ; H05K3/30 ; H05K3/32
Abstract:
The method for assembling a microelectronic chip device (101) in a fabric (104) comprises the following steps: providing a microelectronic chip device (101) comprising a base (102) and a protruding element (103) rising from a face of the base (102), said protruding element (103) comprising a free end opposite the base (102); inserting into the fabric (104) the chip device (101) by the free end of the protruding element; deforming the protruding element (105) at its free end so as to ensure the securing of the chip device (101) with the fabric (104) by forming a crimping bead (106).
Public/Granted literature
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