Invention Grant
- Patent Title: Conductivity inspection method of printed circuit board and manufacturing method of printed circuit board
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Application No.: US14477178Application Date: 2014-09-04
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Publication No.: US10264684B2Publication Date: 2019-04-16
- Inventor: Terukazu Ihara , Kouji Ichinose
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2013-183768 20130905
- Main IPC: H05K3/40
- IPC: H05K3/40 ; G01R31/28 ; G11B5/455 ; H05K1/02 ; G11B5/48 ; H05K1/11 ; H05K3/46

Abstract:
First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.
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