Invention Grant
- Patent Title: Seamless sleeve and seamless substrate
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Application No.: US14584945Application Date: 2014-12-29
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Publication No.: US10265745B2Publication Date: 2019-04-23
- Inventor: Louis M. Spoto , Dean J. Randazzo , Matthew J. Deschner , William A. Herring , Shannon K. Crawford-Taylor , Suwit Sangkaratana , Paul R. Jelonek , Alan J. Varacins
- Applicant: Illinois Tool Works Inc.
- Applicant Address: US IL Glenview
- Assignee: ILLINOIS TOOL WORKS INC.
- Current Assignee: ILLINOIS TOOL WORKS INC.
- Current Assignee Address: US IL Glenview
- Agency: Levenfeld Pearlstein, LLC
- Main IPC: B21B27/03
- IPC: B21B27/03 ; B21B27/00 ; B31F1/07 ; B41N6/00 ; B44B5/00 ; B44B5/02 ; B21B27/02 ; B29C59/02 ; B29C59/04

Abstract:
A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.
Public/Granted literature
- US20150114062A1 SEAMLESS SLEEVE AND SEAMLESS SUBSTRATE Public/Granted day:2015-04-30
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