Invention Grant
- Patent Title: Transfer robot with substrate cooling
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Application No.: US13006865Application Date: 2011-01-14
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Publication No.: US10265868B2Publication Date: 2019-04-23
- Inventor: Shinichi Kurita , Makoto Inagawa , Takayuki Matsumoto
- Applicant: Shinichi Kurita , Makoto Inagawa , Takayuki Matsumoto
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B25J19/00 ; B65G49/06 ; C03B35/20 ; H01L21/677
Abstract:
Embodiments of the present invention provide a transfer robot having a cooling plate attached thereto for cooling a substrate during transfer between a processing chamber and a load lock chamber. In one embodiment, the cooling plate is a single, large area cooling plate attached to the transfer robot beneath the substrate being transferred. In another embodiment, the cooling plate is an array of substrates attached to the transfer robot beneath the substrate being transferred. The cooling plate may include a conduit path for circulating a cooling fluid throughout the cooling plate. The cooling plate may have an upper surface with a high emissivity coating applied thereto.
Public/Granted literature
- US20110182699A1 TRANSFER ROBOT WITH SUBSTRATE COOLING Public/Granted day:2011-07-28
Information query
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