Invention Grant
- Patent Title: Packages and methods for manufacturing packages
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Application No.: US15175908Application Date: 2016-06-07
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Publication No.: US10266329B2Publication Date: 2019-04-23
- Inventor: Aaron R. Bentz
- Applicant: Bemis Company, Inc.
- Applicant Address: US WI Neenah
- Assignee: Bemis Company, Inc.
- Current Assignee: Bemis Company, Inc.
- Current Assignee Address: US WI Neenah
- Agent Lynn M. Nett
- Main IPC: B65D75/30
- IPC: B65D75/30 ; B65D65/14 ; B32B27/06 ; B32B7/12 ; B65D75/58 ; B32B7/06 ; B32B3/26 ; A61B50/30 ; A61B50/00
Abstract:
A package that includes a housing portion, a handling portion and a separation feature. The separation feature facilitates separation of the handling and housing portions. The separation feature includes a first release layer and a second release layer adjacent to the first release layer provided between the first and second films at an overlapping portion of the housing portion and the handling portion.
Public/Granted literature
- US20170349347A1 PACKAGES AND METHODS FOR MANUFACTURING PACKAGES Public/Granted day:2017-12-07
Information query
IPC分类:
