A ceramic electronic component includes an electronic component body, an inner electrode, and an outer electrode. The outer electrode includes a fired electrode layer and first and second plated layers. The fired electrode layer is disposed on the electronic component body. The first plated layer is disposed on the fired electrode layer. The thickness of the first plated layer is about 3 μm to about 8 μm, for example. The first plated layer contains nickel. The second plated layer is disposed on the first plated layer. The thickness of the second plated layer is about 0.025 μm to about 1 μm, for example. The second plated layer contains lead.