Invention Grant
- Patent Title: Semiconductor manufacturing apparatus and method of operating the same
-
Application No.: US15701662Application Date: 2017-09-12
-
Publication No.: US10269608B2Publication Date: 2019-04-23
- Inventor: Yuya Matsuda
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-169673 20150828
- Main IPC: H01L21/308
- IPC: H01L21/308 ; H01L21/683 ; H01L21/66 ; H01L21/67 ; H01L21/311 ; H01J37/32
Abstract:
In one embodiment, a semiconductor manufacturing apparatus includes an electrostatic chuck that includes a base and a first electrode provided on the base and is configured to electrostatically adsorb a wafer on the first electrode. The apparatus further includes a measurement module configured to measure potential of the wafer. The apparatus further includes a controller configured to adjust potential of the base based on the potential of the wafer and to adjust potential of the first electrode based on the potential of the wafer or the base, when the potential of the wafer measured by the measurement module changes.
Public/Granted literature
- US20180005861A1 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF OPERATING THE SAME Public/Granted day:2018-01-04
Information query
IPC分类:
