Invention Grant
- Patent Title: Packaged semiconductor devices and methods of packaging semiconductor devices
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Application No.: US15906399Application Date: 2018-02-27
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Publication No.: US10269673B2Publication Date: 2019-04-23
- Inventor: Chen-Hua Yu , Chung-Shi Liu , Chih-Fan Huang , Chih-Wei Lin , Wei-Hung Lin , Ming-Da Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/768 ; H01L21/82 ; H01L23/00 ; H01L23/04 ; H01L23/498 ; H01L23/528 ; H01L23/538 ; H01L25/10 ; H01L23/31 ; H01L23/367
Abstract:
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and the molding compound. The molding compound is thicker than the integrated circuit die.
Public/Granted literature
- US20180190559A1 Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices Public/Granted day:2018-07-05
Information query
IPC分类:
