Invention Grant
- Patent Title: Conductive line system and process
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Application No.: US15837194Application Date: 2017-12-11
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Publication No.: US10269675B2Publication Date: 2019-04-23
- Inventor: Yu Yi Huang , Hung-Jui Kuo , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/768 ; H01L21/02 ; H01L21/027 ; H01L21/288 ; H01L23/00 ; H01L23/29 ; H01L23/532
Abstract:
A system and method for providing a conductive line is provided. In an embodiment the conductive line is formed by forming two passivation layers, wherein each passivation layer is independently patterned. Once formed, a seed layer is deposited into the two passivation layers, and a conductive material is deposited to fill and overfill the patterns within the two passivation layers. A planarization process such as a chemical mechanical polish may then be utilized in order to remove excess conductive material and form the conductive lines within the two passivation layers.
Public/Granted literature
- US20180108590A1 Conductive Line System and Process Public/Granted day:2018-04-19
Information query
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