Invention Grant
- Patent Title: Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
-
Application No.: US14880030Application Date: 2015-10-09
-
Publication No.: US10269682B2Publication Date: 2019-04-23
- Inventor: Cheng-Chieh Hsieh , Chi-Hsi Wu , Shin-Puu Jeng , Tsung-Yu Chen , Wensen Hung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L23/367 ; H01L25/10 ; H01L23/00 ; H01L23/373 ; H01L21/56 ; H01L23/31
Abstract:
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a cooling device for a semiconductor device includes a reservoir having a first plate and a second plate coupled to the first plate. A cavity is between the first plate and the second plate. A phase change material (PCM) is in the cavity. The cooling device is adapted to dissipate heat from a packaged semiconductor device.
Public/Granted literature
- US20170103937A1 Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices Public/Granted day:2017-04-13
Information query
IPC分类:
