Invention Grant
- Patent Title: Composite magnetic sealing material and electronic circuit package using the same as mold material
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Application No.: US15919991Application Date: 2018-03-13
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Publication No.: US10269727B2Publication Date: 2019-04-23
- Inventor: Kenichi Kawabata
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Priority: JP2016-220594 20161111
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/552 ; H01L23/29 ; H01L25/16 ; H01L25/00 ; H01L21/56 ; H01F1/147 ; H01L23/31

Abstract:
Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.
Public/Granted literature
- US20180204805A1 COMPOSITE MAGNETIC SEALING MATERIAL AND ELECTRONIC CIRCUIT PACKAGE USING THE SAME AS MOLD MATERIAL Public/Granted day:2018-07-19
Information query
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