In a semiconductor device, a first semiconductor chip having a main surface provided with a first terminal group including terminals, and a rear face mounted on a surface of a support. A second semiconductor chip has a main surface provided with a second terminal group including terminals, the main surface of the second semiconductor chip facing the main surface of the first semiconductor chip, and each of the terminals in the second terminal group being connected to a corresponding one of the terminals in the first terminal group of the first semiconductor chip. The first semiconductor chip is connected to an external terminal of the semiconductor device via a conductor containing a single metal.