Invention Grant
- Patent Title: Structure for reduced source and drain contact to gate stack capacitance
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Application No.: US15396787Application Date: 2017-01-02
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Publication No.: US10269905B2Publication Date: 2019-04-23
- Inventor: Carl J Radens , Richard Q Williams
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jeffrey S LaBaw; Steven J Meyers
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/06 ; H01L29/78 ; H01L23/535 ; H01L21/027 ; H01L21/306 ; H01L21/683 ; H01L21/768 ; H01L23/528 ; H01L23/532 ; H01L29/45 ; H01L23/522 ; H01L29/423 ; H01L29/786

Abstract:
A structure of a semiconductor device is described. A semiconductor device includes a transistor which further includes a gate structure, a source region and a drain region disposed on a first surface of a substrate. A wiring layer of conductive material is disposed over a second surface of the substrate. The second surface of the substrate is located opposite to the first surface of the substrate. A set of contact studs including a first contact stud which extends completely through the source region and through the substrate to a first respective portion of the wiring layer. The set of contact studs also includes a second contact stud which extends completely through the drain region and through the substrate to a second respective portion of the wiring layer.
Public/Granted literature
- US20170179243A1 STRUCTURE FOR REDUCED SOURCE AND DRAIN CONTACT TO GATE STACK CAPACITANCE Public/Granted day:2017-06-22
Information query
IPC分类: