- Patent Title: Semiconductor device structure and method for fabricating the same
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Application No.: US15630356Application Date: 2017-06-22
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Publication No.: US10269919B2Publication Date: 2019-04-23
- Inventor: Huicai Zhong , Qingqing Liang , Haizhou Yin
- Applicant: Institute of Microelectronics, Chinese Academy of Sciences
- Applicant Address: CN Beijing
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agent Jeffrey S. Bergman
- Priority: CN201010242704 20100730
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/49 ; H01L21/768 ; H01L21/8234 ; H01L29/66 ; H01L29/78 ; H01L27/105 ; H01L27/088 ; H01L27/108

Abstract:
A semiconductor device structure is provided. The semiconductor device includes a semiconductor substrate, a first device, and a second device. Each of the first and second devices includes a gate extending in a first direction, source/drain regions respectively formed on opposite first and second sides of the gate, dielectric spacers formed respectively on outer sidewalls of the gate on the first side and the second side, and conductive spacers serving contacts to the source/drain regions and formed respectively on outer sidewalls of the respective gate spacers. A second direction from the source/drain region on the first side to the source/drain region on the second side crosses the first direction.
Public/Granted literature
- US20170288037A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2017-10-05
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