- Patent Title: Purging deposition tools to reduce oxygen and moisture in wafers
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Application No.: US15246071Application Date: 2016-08-24
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Publication No.: US10269926B2Publication Date: 2019-04-23
- Inventor: Yi-Ying Liu , Chun-Wen Nieh , Yu-Sheng Wang , Yu-Ting Lin , Wei-Yu Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/285 ; H01L21/321 ; H01L29/66 ; C23C16/44 ; H01L21/324 ; H01L21/67 ; H01L21/687 ; H01L21/768 ; H01L29/45 ; H01L29/49 ; H01L29/78
Abstract:
A method includes placing a wafer in a wafer holder, placing the wafer holder on a loadport of a deposition tool, connecting the wafer holder to a front-end interface unit of the deposition tool, purging the front-end interface unit with nitrogen, and depositing a metal layer on the wafer in the deposition tool.
Public/Granted literature
- US20180061959A1 Purging Deposition Tools to Reduce Oxygen and Moisture in Wafers Public/Granted day:2018-03-01
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