Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15812862Application Date: 2017-11-14
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Publication No.: US10269946B2Publication Date: 2019-04-23
- Inventor: Hitoshi Matsuura
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2015-113074 20150603
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/10 ; H01L29/66 ; H01L29/423 ; H01L29/739

Abstract:
A semiconductor device including an IGBT element having features of a low on-state voltage and a low turn-off loss is provided. The semiconductor device is comprised of a trench gate type IGBT element. The IGBT element includes: a plurality of gate trench electrodes to which gate potential is given; and a plurality of emitter trench electrodes to which emitter potential is given. Between adjacent trench electrodes, a contact to an emitter electrode layer is formed. In this regard, there is formed, in the semiconductor substrate, a P type floating region which is in contact with bottom portions of at least some of the emitter trench electrodes via an interlayer insulation layer.
Public/Granted literature
- US20180069110A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-03-08
Information query
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