Invention Grant
- Patent Title: Solid state imaging device, camera module and electronic device
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Application No.: US14775934Application Date: 2014-03-12
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Publication No.: US10270946B2Publication Date: 2019-04-23
- Inventor: Eiichiro Dobashi
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-062021 20130325
- International Application: PCT/JP2014/056523 WO 20140312
- International Announcement: WO2014/156658 WO 20141002
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146
Abstract:
There is provided a solid state imaging device. A rib is arranged on a frame part to be joined to a board on which an image sensor is mounted, the rib abutting on the board at an abutting position next to a periphery of the image sensor.
Public/Granted literature
- US20160028928A1 SOLID STATE IMAGING DEVICE, CAMERA MODULE AND ELECTRONIC DEVICE Public/Granted day:2016-01-28
Information query
