Invention Grant
- Patent Title: Substrate for camera module and camera module having the same
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Application No.: US15370604Application Date: 2016-12-06
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Publication No.: US10270948B2Publication Date: 2019-04-23
- Inventor: Seung Eun Lee , Jin Seon Park , Yul Kyo Chung , Chul Choi , Dae Young Jung , Seung Yeop Kook
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2016-0044257 20160411
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146 ; H01L25/18 ; H01L23/00
Abstract:
A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.
Public/Granted literature
- US20170294469A1 SUBSTRATE FOR CAMERA MODULE AND CAMERA MODULE HAVING THE SAME Public/Granted day:2017-10-12
Information query
