Invention Grant
- Patent Title: Mold assembly and method of molding a component
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Application No.: US14984080Application Date: 2015-12-30
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Publication No.: US10279519B2Publication Date: 2019-05-07
- Inventor: David Bartlett , Elizabeth O'Neill , Robert Moser , Roger Dickerhoof , Carl Miller , Joshua Jeffers , Bryan Woosley , James Merryfield
- Applicant: The United States of America as represented by the Secretary of the Navy
- Applicant Address: US DC Washington
- Assignee: The United States of America, as represented by the Secretary of the Navy
- Current Assignee: The United States of America, as represented by the Secretary of the Navy
- Current Assignee Address: US DC Washington
- Agent Christopher A. Monsey
- Main IPC: H01R9/00
- IPC: H01R9/00 ; B29C45/14 ; B29C45/00 ; C08G73/00 ; B29K63/00 ; B29L31/36
Abstract:
A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.
Public/Granted literature
- US20170190082A1 MOLD ASSEMBLY AND METHOD OF MOLDING A COMPONENT Public/Granted day:2017-07-06
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