Invention Grant
- Patent Title: Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
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Application No.: US14967851Application Date: 2015-12-14
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Publication No.: US10279568B2Publication Date: 2019-05-07
- Inventor: Yoshiharu Miwa , Yoshinori Hasegawa , Takayuki Noda , Hiroki Mori , Michiharu Eta
- Applicant: Nippon Electric Glass Co., Ltd.
- Applicant Address: JP Shiga
- Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee Address: JP Shiga
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2011-108458 20110513; JP2011-247451 20111111; JP2011-252966 20111118
- Main IPC: B32B17/00
- IPC: B32B17/00 ; C03B33/00 ; B29B9/00 ; B32B17/10 ; C03B33/07 ; C03B33/09 ; C03B33/04 ; B28D1/22 ; B23K26/08 ; B23K26/40 ; B29C67/00 ; B32B37/14 ; B23K103/16 ; B23K103/00 ; G02F1/1333
Abstract:
Provided is a laminate (1) obtained by integrally laminating glass sheets (4) on both surfaces of a resin sheet (2). The glass sheets (4) have a thickness of 300 μm or less and end surfaces (4a) of the glass sheets (4) are chamfered.
Public/Granted literature
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