A method for encapsulation of microelectronic components includes making a portion of sacrificial material on a front face of a first substrate in which the component is to be made. The method then includes making a cover encapsulating the portion of sacrificial material, and making the component by etching the first substrate from its back face. The etching is such that part of the component faces the portion of the sacrificial material, and such that the portion of sacrificial material is accessible from a back face of the component. The method then includes eliminating the portion of the sacrificial material by etching from the back face of the component, and securing the back face of the component to a second substrate.