Invention Grant
- Patent Title: Adhesive agent composition and adhesive agent
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Application No.: US15517675Application Date: 2015-10-28
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Publication No.: US10280341B2Publication Date: 2019-05-07
- Inventor: Asako Ogasawara , Shigeru Kigasawa , Masatake Joyabu
- Applicant: DAI-ICHI KOGYO SEIYAKU CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: DAI-ICHI KOGYO SEIYAKU CO., LTD.
- Current Assignee: DAI-ICHI KOGYO SEIYAKU CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2014-229347 20141111
- International Application: PCT/JP2015/080400 WO 20151028
- International Announcement: WO2016/076115 WO 20160519
- Main IPC: C08F2/24
- IPC: C08F2/24 ; C08F220/30 ; C09J4/00 ; C09J11/06 ; C09J125/18 ; C09J157/04
Abstract:
The present invention relates to an adhesive agent composition, containing an aqueous resin dispersion obtained by subjecting a polymerizable compound (C) containing a compound (C1) having a carbon-carbon unsaturated bond to an emulsion polymerization in the presence of a surfactant (A) and a surfactant (B) free from a radical-polymerizable substituent.
Public/Granted literature
- US20170306192A1 ADHESIVE AGENT COMPOSITION AND ADHESIVE AGENT Public/Granted day:2017-10-26
Information query
