Invention Grant
- Patent Title: Roughened copper foil, copper clad laminate, and printed circuit board
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Application No.: US15528872Application Date: 2016-04-06
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Publication No.: US10280501B2Publication Date: 2019-05-07
- Inventor: Satoshi Mogi , Hiroaki Tsuyoshi
- Applicant: MITSUI MINING & SMELTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-194225 20150930
- International Application: PCT/JP2016/061317 WO 20160406
- International Announcement: WO2017/056534 WO 20170406
- Main IPC: B21C37/00
- IPC: B21C37/00 ; C23C8/42 ; B32B15/20 ; C25D1/04 ; C23C26/00 ; C23C8/80 ; C23C28/00 ; C25D3/38 ; C25D5/48 ; H05K3/02 ; H05K3/18 ; H05K3/38 ; H05K1/09
Abstract:
There is provided a roughened copper foil which can significantly improve adhesion to an insulating resin and reliability (e.g., hygroscopic heat resistance). The roughened copper foil of the present invention has at least one roughened surface having fine irregularities composed of acicular crystals, wherein the entire surface of the acicular crystals is composed of a mixed phase of Cu metal and Cu2O.
Public/Granted literature
- US20180223412A1 ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD Public/Granted day:2018-08-09
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