Invention Grant
- Patent Title: Terminal board for temperature compensation of thermocouple
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Application No.: US15319165Application Date: 2015-08-10
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Publication No.: US10281339B2Publication Date: 2019-05-07
- Inventor: Hwan Ki Park
- Applicant: AUTONICS CORPORATION
- Applicant Address: KR Busan
- Assignee: AUTONICS CORPORATION
- Current Assignee: AUTONICS CORPORATION
- Current Assignee Address: KR Busan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2014-0104680 20140812
- International Application: PCT/KR2015/008324 WO 20150810
- International Announcement: WO2016/024767 WO 20160218
- Main IPC: G01K1/00
- IPC: G01K1/00 ; G01K7/00 ; G01K1/20 ; G01K1/14 ; G01K7/02

Abstract:
The present invention provides a terminal board for temperature compensation of a thermocouple, the terminal board comprising: -shaped terminal unit for connecting a compensation lead wire of the thermocouple to a PCB contact terminal connected to a control circuit of a circuit board so as to allow accurate temperature compensation of the thermocouple, the terminal unit having a pair of curved connection pins; a small-sized compensation sensor PCB which has a chip type temperature sensor for compensation at one end of the upper side thereof, an upper soldering surface which is soldered to a sensor pin unit for electrically connecting an output of the temperature sensor for compensation, and a lower soldering surface which is soldered to the terminal unit; and an L-shaped sensor pin unit for soldering the compensation sensor PCB together with the terminal unit, the sensor pin unit having a pair of rounded connection pins for contact-connection of the output of the temperature sensor for compensation to the temperature compensation sensor of the circuit board.
Public/Granted literature
- US20170131151A1 TERMINAL BOARD FOR TEMPERATURE COMPENSATION OF THERMOCOUPLE Public/Granted day:2017-05-11
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