Apparatus for facilitating analytical probing of a packaged electronic device is provided. The device may provide a test chamber that holds the device to be tested and provides an elevated or reduced temperature environment to conduct testing of the device at end-use application temperature levels. The apparatus includes a test chamber having perimeter walls and a configurable cover. The cover includes an adjustable position probe entry port or aperture that may be positioned to provide probe access to any point within the test chamber, and may comprise a cover with such positionable port or a plurality of overlapping plates such as a first plate with a cutout quadrant that can be oriented to expose any quadrant of the test chamber and a second plate with at least one probe entry port that can be situated in the cutout to provide the probe entry port above a desired test area of the electronic device. A height adjustable framework supported above the test chamber allows a probe manipulator to be brought into a required position to operate a probe through the probe entry port of the test chamber and into contact with the packaged electronics. A microscope is positionable above the probe manipulator to assist in placement of the probe. The apparatus is designed so that temperature controlled air may be provided to the test chamber to facilitate testing at elevated or reduced temperatures.