Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.