Invention Grant
- Patent Title: Package modules and methods of testing operations of chips included therein
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Application No.: US15862730Application Date: 2018-01-05
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Publication No.: US10282289B2Publication Date: 2019-05-07
- Inventor: Hak Song Kim , Min Su Park
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2017-0112713 20170904
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G06F12/02 ; G06F3/06 ; G11C7/10 ; G11C16/26 ; G11C5/02 ; G11C16/04
Abstract:
A package module may be provided. The package module may include a first chip and a second chip. The first chip may be configured to receive first pattern data to generate first transmission data in a first write mode. The second chip may be configured to receive the first transmission data to generate and output first sense data in a first read mode.
Public/Granted literature
- US20190073294A1 PACKAGE MODULES AND METHODS OF TESTING OPERATIONS OF CHIPS INCLUDED THEREIN Public/Granted day:2019-03-07
Information query
