Invention Grant
- Patent Title: Semiconductor integrated circuit
-
Application No.: US15914971Application Date: 2018-03-07
-
Publication No.: US10282317B2Publication Date: 2019-05-07
- Inventor: Yuji Hisamatsu
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2017-179423 20170919
- Main IPC: G11C7/10
- IPC: G11C7/10 ; G06F13/00 ; G06F13/16 ; G06F1/08

Abstract:
According to one embodiment, a semiconductor integrated circuit includes a bus master, a bus slave and a clock gating circuit. The bus master outputs an access request. The bus slave transmits a response to the access request to the bus master. The clock gating circuit shuts off clocks supplied to the bus slave. The bus slave includes a control circuit which outputs first and second signals in response to the access request; a first circuit which outputs a third signal in response to a clock supplied from the clock gating circuit, when the first signal is asserted; and a second circuit which receives the third signal output from the first circuit and the second signal, and outputs a fourth signal as the response to the bus master, when the second signal is asserted.
Public/Granted literature
- US20190087361A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2019-03-21
Information query