Invention Grant
- Patent Title: Chip fuse
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Application No.: US15593331Application Date: 2017-05-12
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Publication No.: US10283298B2Publication Date: 2019-05-07
- Inventor: Toshitaka Ogawa , Hiroo Arikawa
- Applicant: SOC Corporation
- Applicant Address: JP Tokyo
- Assignee: SOC Corporation
- Current Assignee: SOC Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Main IPC: H01H85/143
- IPC: H01H85/143 ; H01H69/02 ; H01H85/06 ; H01H85/08 ; H01H85/041 ; H01H85/046

Abstract:
A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.
Public/Granted literature
- US20170250046A1 CHIP FUSE MANUFACTURING METHOD AND CHIP FUSE Public/Granted day:2017-08-31
Information query
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