A semiconductor package including at least one integrated circuit component, a glue material, an insulating encapsulation, and a redistribution circuit structure is provided. The glue material encapsulates the at least one integrated circuit component and has a first surface and a second surface opposite to the first surface, wherein the at least one integrated circuit component is exposed by the first surface of the glue material, and an area of the first surface is smaller than an area of the second surface. The insulating encapsulation encapsulates the glue material, wherein an interface is between the glue material and the insulating encapsulation. The redistribution circuit structure is disposed on the at last one integrated circuit component, the glue material and the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the at least one integrated circuit component.