Invention Grant
- Patent Title: Heat dissipation component and terminal device including heat dissipation component
-
Application No.: US15701735Application Date: 2017-09-12
-
Publication No.: US10283435B2Publication Date: 2019-05-07
- Inventor: Kouichi Shinotou , Tadanori Tachikawa , Masashi Yamashita
- Applicant: Fujitsu Client Computing Limited
- Applicant Address: JP Kanagawa
- Assignee: Fujitsu Client Computing Limited
- Current Assignee: Fujitsu Client Computing Limited
- Current Assignee Address: JP Kanagawa
- Agency: Osha Liang LLP
- Priority: JP2016-191208 20160929
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H01L23/427

Abstract:
A heat dissipation component includes a plate that presses a heat receiving portion against a heat generating portion, and a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion, wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate, an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.
Public/Granted literature
- US20180090416A1 HEAT DISSIPATION COMPONENT AND TERMINAL DEVICE INCLUDING HEAT DISSIPATION COMPONENT Public/Granted day:2018-03-29
Information query
IPC分类: