Invention Grant
- Patent Title: Polymer resin and compression mold chip scale package
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Application No.: US15168467Application Date: 2016-05-31
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Publication No.: US10283466B2Publication Date: 2019-05-07
- Inventor: Yusheng Lin , Soon Wei Wang , Chee Hiong Chew , Francis J. Carney
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: IPTechLaw
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/683 ; H01L21/78 ; H01L23/31 ; H01L21/56
Abstract:
A method for fabricating a chip scale package, comprising: providing a wafer; applying a polymer resin on at least part of a first surface of the wafer and to one or more sides of the wafer; and applying a compression mold on at least part of a second surface of the wafer and to one or more sides of the wafer, said first and second surfaces opposing each other.
Public/Granted literature
- US20170345779A1 POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE Public/Granted day:2017-11-30
Information query
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