A method for forming a chip package structure is provided. The method includes forming a first dielectric layer over a carrier substrate. The first dielectric layer is a continuous dielectric layer and has openings. The method includes forming a first wiring layer over the first dielectric layer and in the openings. The first dielectric layer and the first wiring layer together form a redistribution structure, and the redistribution structure has a first surface and a second surface. The method includes disposing a first chip and a first conductive bump over the first surface. The method includes forming a first molding layer over the first surface. The method includes removing the carrier substrate. The method includes disposing a second chip and a second conductive bump over the second surface. The method includes forming a second molding layer over the second surface.