Invention Grant
- Patent Title: Method of forming vertical field effect transistors with self-aligned gates and gate extensions and the resulting structure
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Application No.: US15709500Application Date: 2017-09-20
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Publication No.: US10283621B2Publication Date: 2019-05-07
- Inventor: Ruilong Xie , Lars Liebmann , Hui Zang , Steven Bentley
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent Anthony J. Canale
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
Disclosed is a method of forming an integrated circuit (IC) that incorporates multiple vertical field effect transistors (VFETs) (e.g., in a VFET array). In the method, self-aligned gates for each pair of VFETs and a self-aligned gate extension for contacting those self-aligned gates are essentially simultaneously formed such that the gates wrap around a pair of semiconductor fins, which are in end-to-end alignment, and such that the gate extension fills the space between adjacent ends of those semiconductor fins. By forming self-aligned gates and a self-aligned gate extension for a pair of VFETs, the method avoids the need for lithographically patterning extension cut isolation regions between adjacent pairs of VFETs in a VFET array. Thus, the method enables implementation of VFET array designs with a reduced fin pitch without incurring defects caused, for example, by overlay errors. Also disclosed herein is an IC formed according to the method.
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