A first dielectric resonator component is joined to a second dielectric resonator component by bonding a first face of the first dielectric resonator component to a second face of the second dielectric resonator component. The first face has a first coupling aperture formed by removing a portion of a coating of first conductive material from the first dielectric resonator component, and the second face has a second coupling aperture formed by removing a portion of a coating of second conductive material from the second dielectric resonator component. The first coupling aperture and said second coupling aperture are aligned with one another when said first face is bonded to the second face. The first dielectric resonator component, which is slab-shaped, and the second dielectric resonator component, which is generally cubed-shaped, form a linear stack having two end faces and four side faces. A first hole is provided at a point along a center line of a side face of the first dielectric resonator component in the direction of orientation of the linear stack, and a second hole is provided substantially in the center of a side face of the second dielectric resonator component to tune a resonant frequency of the pair of joined dielectric resonator components.