The present application provides a housing for an electronic device sub-assembly for use in an electronic device having wireless communication capabilities. The electronic device sub-assembly includes a loop antenna structure having a conductive ground structure, and a conductive loop element separate from the conductive ground structure. The conductive loop element has two ends and a conductive path, which extends between the two ends a distance away from the conductive ground structure. The conductive loop element is coupled to the conductive ground structure at each of the two ends, and the distance that the conductive path of the conductive loop element extends away from the conductive ground structure encloses an area forming a loop which is internal to the loop antenna structure. The electronic device sub-assembly further includes a signal source coupled between the conductive loop element and the conductive ground structure across the loop for applying a drive signal. The electronic device sub-assembly still further includes one or more auxiliary electronic elements, where the one or more auxiliary electronic elements each have a primary purpose that is separate from the loop antenna structure. The one or more auxiliary electronic elements each include a ground which is coupled to the conductive ground structure via the conductive loop element.