Invention Grant
- Patent Title: Load center thermally conductive component
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Application No.: US15078473Application Date: 2016-03-23
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Publication No.: US10283945B2Publication Date: 2019-05-07
- Inventor: Peter James Fritz
- Applicant: EATON CORPORATION
- Applicant Address: IE Dublin 4
- Assignee: EATON INTELLIGENT POWER LIMITED
- Current Assignee: EATON INTELLIGENT POWER LIMITED
- Current Assignee Address: IE Dublin 4
- Agency: Eckert Seamans Cherin & Mellott, LLC
- Main IPC: H02B1/56
- IPC: H02B1/56 ; H02G3/03
Abstract:
Devices and systems for dissipating heat generated from heat generating components in a load center are provided herein. The disclosed concept provides a heat dissipating component that assists in heat dissipation of a heat generating component in a load center by transferring heat from the heat generating component to a non-heat generating component.
Public/Granted literature
- US20170279253A1 LOAD CENTER THERMALLY CONDUCTIVE COMPONENT Public/Granted day:2017-09-28
Information query
