The present application provides an electromagnetic coupling interface and a method for managing an electromagnetic coupling capability relative to a particular charge location with an electromagnetic coupling interface. The electromagnetic coupling interface includes a carrier substrate including two or more moveably coupled segments, the carrier substrate having at least two use positions, where in each use position the two or more moveably coupled segments have a different spatial arrangement. The electromagnetic coupling further includes two or more sets of conductors, where each set of conductors is associated with a respective one of the two or more moveably coupled segments of the carrier substrate and is associated with one or more coils in each of the at least two use positions.