Invention Grant
- Patent Title: Acoustic wave devices having improved connection reliability
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Application No.: US15449104Application Date: 2017-03-03
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Publication No.: US10284171B2Publication Date: 2019-05-07
- Inventor: Mitsunori Miyanari , Yosuke Hamaoka , Toru Yamaji , Hidekazu Nakanishi , Hiroyuki Nakamura
- Applicant: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Applicant Address: JP Kadoma-Shi
- Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Current Assignee: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Current Assignee Address: JP Kadoma-Shi
- Agency: Lando & Anastasi, LLP
- Priority: JP2014-139343 20140707
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/25 ; H01L41/29 ; H03H9/72 ; H03H3/08

Abstract:
An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.
Public/Granted literature
- US20170179921A1 ACOUSTIC WAVE DEVICES HAVING IMPROVED CONNECTION RELIABILITY Public/Granted day:2017-06-22
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